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    Module Assembly
    
					
    HENGHUI provides customers with industry-leading smart card module packaging and testing solutions, offering one-stop packaging and testing services for products including 6PIN/8PIN contact modules, contactless modules, dual-interface modules, and customized modules. Products are widely used in core areas such as financial payment, identity recognition, and IoT security. Relying on an advanced R&D system and a strict quality system, our products demonstrate excellent stability and security in harsh environments, providing reliable hardware support for global digitalization.						
    
				
    
			
    
		
    
	
    
	    
	
    
	    
	
    
    
    
	    
    
		    
    6PIN Dual-interface Smart Card Module
    
			
    
				
    
				    				
    
				
    
				    				
    
			
    
			
			
    
				
    
					
    
						
    
    

    

    
    Module Thickness: 

    

    
    Max. 580μm

    

    
    
    

    

    
    Application Area: 

    

    
    finance, social security, electronic currency, mobile payment, health, education, logistics, and public security, etc.

    

    
    
    

    

    
  Features & Advantages: 

    

    
    Adapt to mainstream financial and security chips
A variety of wires such as gold wire and alloy wire are available.
The encapsulation technical supports both Glop top and Dam fill.